一、TAB（TAPE AUTOMATED BONDING)

　　驱动芯片封装在软性排線(xiàn)上，排線(xiàn)两端分(fēn)别与液晶片及客户控制板相连，产品结构较為(wèi)紧凑，功耗低，适用(yòng)于MP3等个人消费電(diàn)子产品。

　　Chips assembled on a flexible connector, hot sealed between LCD panel and control board. Compact in size, low power consumption, suitable for consumer electronics such mp3 players.

　　二、COG（CHIP ON GLASS)

　　驱动芯片直接封装在液晶片上，产品结构紧凑，性能(néng)可(kě)靠，功耗低，成本相对较低，广泛应用(yòng)于手机、電(diàn)话机等大批量生产的数码電(diàn)子产品。

　　Chips assembled directly on LCD glass, Compact in size, low cost, low power consumption, widely used in digital products such as telephones, mobile phones etc.